Panel session
Thursday Tomorrow’s Cybersecurity AM
RISC-V, opportunities for cybersecurity?
Thursday Tomorrow’s Cybersecurity PM
Connectivity impacts on the security of components and products?
Thursday Plenary Session AM
Learn about the challenges faced by semiconductor players, how they are finding a path to effective solutions and encompassing the near future. From sovereignty to a low carbon footprint, how AI, heterogeneity and dense semiconductors can suit tomorrow's products such as automotive, personal computer or smartphone.
Gregg Bartlett, Global Foundries; Tim Archer, Lam Research; Ned Curic, Stellantis; Frédéric Godemel, Schneider Electric; Hisashi Kanazashi, METI; Pierre Barnabé, Soitec; Jean-René Lèquepeys, CEA-Leti (from left to right)
Thursday RF & Telecommunications AM
High expectations come from new mmW spectrum spaces availability. Promises for higher bandwidth, data rates, and connectivity ability. But also questions about demanding technologies and costs increase. Experts from CEA-Leti and industries will share their thoughts about this.
Thursday Quantum Computing AM
Thursday Photonics: Data & Sensing AM
A roundtable discussion to listen and question industry and research scientists on the perspectives and expected impact of Photonics for both communication and computing fields in the years to come.
Frédéric Boeuf, ST; Benoit Charbonnier, CEA-Leti; Yvain Thonnart, CEA-Leti; Thomas Van Vaerenbergh, HPE (from left to right)
Thursday Photonics: Data & Sensing PM
A roundtable discussion with experts in the field of Optics based Sensing, aimed at fostering insightful and engaging conversations on Integrated Photonics for Biomedical and Chemical Sensing applications.
Badhise Ben Bakir, CEA-Leti | Hélène Lefebvre, ECLYPIA | Laurent Duraffourg, ADMIR Analysis | Loïc Laplatine, CEA-Leti (from left to right)
Thursday Memory for Edge Computing AM
Which memory technology for next generation edge computing?
Thursday Plenary Session PM
Learn about the challenges faced by semiconductor players, how they are finding a path to effective solutions and encompassing the near future. From sovereignty to a low carbon footprint, how AI, heterogeneity and dense semiconductors can suit tomorrow's products such as automotive, personal computer or smartphone.
David Andre, Google X; Mukesh Khare, IBM; Agnieszka Thonet, HP; Pat Gelsinger, Intel; Sébastien Dauvé, CEA-Leti; Tetsuro Higashi, Rapidus Corp (from left to right)