Nadia Wetzler, Applied Materials; Yasumitsu Orii, Rapidus Corporation; Antoine Amade, Entegris; Yasutoshi Okuno, Screen; Martine Druges, STMicroelectronics

A roundtable discussion with the adopters of the RISC-V cores regarding opportunities of RISC-V on cybersecurity.

Thierry Collette, Thales; Fabien Clermidy, Open HW Group; Eric Saliba, ANSSI; Serge Maginot, Tiempo Secure; Simon Moore, Cambridge University (from left to right)

A roundtable discussion about the impact of new connectivity technologies on cybersecurity.

Yacine Felk,  CYSEC; Fabrice Isnard, FARE—Réseau DEF; Christophe Laurencin, STMicroelectronics; Eric Mercier, CEA-Leti; Alexandre Aubry, Stellantis (from left to right)

Learn about the challenges faced by semiconductor players, how they are finding a path to effective solutions and encompassing the near future. From sovereignty to a low carbon footprint, how AI, heterogeneity and dense semiconductors can suit tomorrow's products such as automotive, personal computer or smartphone.

Gregg Bartlett, Global Foundries; Tim Archer, Lam Research; Ned Curic, Stellantis; Frédéric Godemel, Schneider Electric; Hisashi Kanazashi, METI; Pierre Barnabé, Soitec; Jean-René Lèquepeys, CEA-Leti (from left to right)

High expectations come from new mmW spectrum spaces availability. Promises for higher bandwidth, data rates, and connectivity ability. But also questions about demanding technologies and costs increase. Experts from CEA-Leti and industries will share their thoughts about this.

Fredrick Tillman, Ericsson AB; Hervé Boutry, CEA-Leti; Jérôme Prouvée, CEA-Leti; Pierre Busson, STMicroelectronics; Thomas Meyer, STMicroelectronics (from left to right)

Next mobile generation will highly consider IoT communication links and disaggregated connectivity, this latter as a beneficial feature for better and more efficient coverage. New modalities like NTN / HAPS are listed amongst the most promising for full coverage. In addition, small-cell deployments will enable flexible and local connectivity as part of the 6G possible deployment.

Paul Vincent, IRT Saint Exupery; Rafik Zayani, CEA-Leti; Jean Schwoerer, Orange (from left to right)

Hear insights and forecasts about State aids and support strategies for quantum computing.

Fabrice Debbasch, French National Research Agency; Olivier Tonneau, Quantonation; Kenzo Bounegta, Le Lab Quantique

A roundtable discussion to listen and question industry and research scientists on the perspectives and expected impact of Photonics for both communications and computing in the years to come.

Frédéric Boeuf, STMicroelectronics; Benoit Charbonnier, CEA-Leti; Yvain Thonnart, CEA-Leti; Thomas Van Vaerenbergh, HPE (from left to right)

A roundtable discussion with experts in the field of Optics based Sensing, aimed at fostering insightful and engaging conversations on Integrated Photonics for Biomedical and Chemical Sensing applications.

Badhise Ben Bakir, CEA-Leti | Hélène Lefebvre, ECLYPIA | Laurent Duraffourg, ADMIR Analysis | Loïc Laplatine, CEA-Leti (from left to right)

Nicolas Leterrier, Schneider Electric; Rémi Bastien, NextMove; James Newton, Altyor Group; Anders S.G. Andrae, Huawei; Vincent Semetey, CNRS (from left to right)

A roundtable discussion with quantum computing end users:
Hear more about quantum computing applications and NISQ vs LSQ questions.

Frederic Barbaresco, Thales; Anne-Lise Guilmin, ATOS/Eviden; Thimothée Silvestre, CEA

Ilan Sever, Weebit Nano; Johannes Müller, Globalfoundries; Hitoshi Saito, Fujitsu semiconductor; Masanori Tsukamoto, Sony Semiconductor Solutions; Andrea Redaelli, STMicroelectronics (from left to right)

Learn about the challenges faced by semiconductor players, how they are finding a path to effective solutions and encompassing the near future. From sovereignty to a low carbon footprint, how AI, heterogeneity and dense semiconductors can suit tomorrow's products such as automotive, personal computer or smartphone.

David Andre, Google X; Mukesh Khare, IBM; Serge Nicoleau, STMicroelectronics; Agnieszka Thonet, HP; Pat Gelsinger, Intel; Sébastien Dauvé, CEA-Leti; Tetsuro Higashi, Rapidus Corp (from left to right)

Andreja Erbes, STMicroelectronics; Stephen Bart, TDK; Joost van Beek, Philips MEMS Foundry. (from left to right)

Ying Lia Li,  Zero Point Motion;  Marc Sansa Perna, CEA-Leti. (from left to right)

How close are we from a mature chiplet ecosystem for heterogenous integration ?

Jean-Philippe Fricker, Cerebras Systems; Denis Dutoit, CEA-List; Jean Charbonnier, CEA-Leti; Emilie Bourjot, CEA-Leti; Dale McHerron, IBM; Darius Bunandar, Lightmatter. (from left to right)

Yvan Morandini, Soitec; Perrine Batude, CEA-Leti; Jean-Baptiste David, CEA-Leti; Alexandre Giry, CEA-Leti; Kazuaki Deguchi, Murata. (from left to right)

Learn about the challenges faced by semiconductor players, how they are finding a path to effective solutions and encompassing the near future. From sovereignty to a low carbon footprint, how AI, heterogeneity and dense semiconductors can suit tomorrow's products such as automotive, personal computer or smartphone.

Laith Altimime, Semi Europe; Fabio Gualandris, STMicroelectronics; Jean-Philippe Fricker, Cerebras Systems; Sanjay Natarajan, Intel;  David Anderson, NY CREATES & The Albany Nanotech Complex; Coby Hanoch, CEO Weebit Nano (from left to right)

Learn about the challenges faced by semiconductor players, how they are finding a path to effective solutions and encompassing the near future. From sovereignty to a low carbon footprint, how AI, heterogeneity and dense semiconductors can suit tomorrow's products such as automotive, personal computer or smartphone.

Stefan Finkbeiner, Bosch Sensortec GmbH; Tod Sizer, Nokia; Bernhard Quendt, Thales Group; Laura Matz, Merck; Sébastien Dauvé, CEA-Leti. (from left to right)

Learn how industrials and academic leaders face the challenges of continuous innovation and reduced time-to-market for emerging sensors targeting environmental applications. The global demand for such sensors continued to rise for year to year amid the pressure of today and tomorrow’s environmental challenges, requiring to find a path for fast-track for innovation from lab to fab for new generations of smart, low power and small devices.

Marc Chaigneau, Horiba; Cyril Herrier, Aryballe; Pierre Jallon, eLichens; Pascal Mailley, CEA-Leti. (from left to right)

Andrea Illiberi, ASM CORPORATE R&D; Milan Pešić, Applied Materials; Milind Weling, Merck. (from left to right)

Nicola Di Pietro, HPE; David Moussaud, CEA-Leti; Laurent Dizambourg, Stellantis. (from left to right)