Lithography Workshop: 
from optical to Alternative patterning technologies
Lithography is and will remain the key knob for the development and ramp-up of any technology. Depending on the challenge of the design rules, the patterning strategy will define the future architecture and performances of your device. On this landscape, optical lithography represents the reference lithography solution. Nevertheless, resolution and nowadays alignment performances are the key drivers from the process side. When cost of ownership starts to be taken into account in the decision chain balance, final decision of the manager has to remain pragmatic. In that context, alternative patterning techniques may have a high-level of competitive advantages, as they could offer challenging and credible industrial compromises.
The workshop will present the “LETI lithocluster” environment.
This event will allow you to have a detailed overview of the LETI pilot line in terms of patterning capability:
- R&D optical lithography
- The evolution of the LETI lithography capabilities with the start-up of a new 193nm immersion program
- A general overview on the advanced works focused on three alternative patterning technologies currently under assessment: DSA, Full wafer scale imprint and Massively parallel Direct write, respectively done in partnership with ARKEMA, EV Group and MAPPER. Presentations will be both technical and business oriented.
This workshop will also provide you with insightful views from leading executives, scientists and entrepreneurs and will give you the opportunity to broaden your business network.
Workshop Technical Program
FRIDAY, JULY 6 2018: LITHOGRAPHY WORKSHOP
09:00 am
| - Opening Session by Laurent Pain Patterning program manager & business development - 5 min
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Introduction: the importance of lithography in today's technologies – 40min
- Lithography and
process variability assumptions for silicon chip manufacturing - Bertrand Le Gratiet - STMicroelectronics - Senior
Principal Engineer, Technical Patterning Coordinator - 20 min
- Lithography technologies for More than Moore devices – YOLE –
Amandine Pizzagalli – 20 min
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10h30 Coffee Break – 15min |
| - MAPPER technology outlook– 30 min
MAPPER technology status : Marco Wieland - CTO (to be confirmed)
FLX-1200 ramp-up status at Leti – Jonathan Pradelles – Leti MAPPER tool team leader
- DSA technology: development status and application fields for CMOS and out of CMOS
– 30 min Material and DSA technology insertion demonstration – Joint presentation:
- Celia Nicolet DSA material development manager – ARKEMA
- Maxime Argoud DSA process integration team leader – Leti
- The joint EVG-Leti program for NIL technology assessment – 30 min
EVG NIL technology development - M Wimplinger EVG – Director Business Unit Technology
INSPIRE program : latest results - Hubert Teyssedre Leti NIL team leader
- The Leti LITHOCLUSTER environment - Laurent Pain Patterning program manager & business development – 15 min- Wrap up
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Fees
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Register for
Lithography workshop:
More info
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General Chair: Laurent Pain, CEA-Leti