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Published on 7 May 2019

Leveraging Silicon photonics and 3D technologies developed at CEA-Leti over the past 15 years, SCINTIL Photonics is being created to industrialize and commercialize the next generation of high speed optical interconnects.

With unique fully integrated solutions, SCINTIL Photonics will boost big ASICs with multi-terabit per second (Tbps) I/O bandwidth for Cloud demanding applications like Machine learning and Artificial Intelligence.

While 'Silicon Photonics technology' is now a best seller as 100 Gigabit per second (Gbps) optical interconnects in Data centers, the lack of integrated lasers on Silicon prevents the solutions from scaling to higher bit rates with Wavelength Division Multiplexing (WDM).

Indium Phosphide (InP) has been the material of choice for making very efficient semiconductor lasers, and 'Indium Phosphide optics' offers WDM interconnect solutions in Data centers, but at higher costs as the solutions are based on the assembly of discrete components.

In addition, next generation interconnects need to get closer to the host ASICs for speed purposes and therefore need to be co packaged with them. Solutions coming into the form of fully integrated circuits that can be packaged with advanced 3D integration technologies are highly awaited.

SCINTIL combines the best of Si and InP materials using wafer-scale bonding of InP on Si, and Relying on existing Commercial Silicon foundry processes.

SCINTIL solution is a fully Integrated Circuit,

  • with integrated multi lasers,

  • with reduced footprint (/ 5), and power consumption (/3)

  • with scaling costs and capacity (through WDM 400G, 800G, 1600G - and complex modulation).

SCINTIL Photonics is laureate of the startup contest 'BPI I-LAB 2018' (Banque Publique d'investissement).