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Silicon Photonics

Silicon Photonics

Published on 13 October 2020


New Perspectives in Silicon Photonics

Tuesday, October 13, 2020 | 14:00 - 17:30

Theme

This workshop will present exclusive insights into silicon photonics R&D roadmaps & perspectives from industry and academia. Keynoters will discuss fundamentals, tools, and applications of silicon photonics.
Work performed in the frame of the IRT Nanoelec consortium 

Target Audience

Industrials : 

  • Silicon photonics designers, foundries, packaging vendors, optics fabs, system vendorsExecutive level,
  • strategic/product marketing, R&D engineers

Academia : 

  • Silicon photonics experts 


General Chair: Eléonore Hardy, CEA-Leti


13.30

​​Registration & Welcome Coffee

14.00

​Opening Session

  •  Eléonore Hardy Business Developer Silicon Photonics, CEA-Leti






14.05



14.20



14.35


​Session #1 : PICs for Data Center Interconnect


Opportunities and challenges for silicon photonics in the datacenter

  • Paraskevas BakopoulosSenior staff engineer, NVIDIA


A high-density and versatile monolithic platform for future optical interconnects

  • David Bitauld, Head of Department III-V/Si, Heterointegration III-V lab

Silicon Photonics towards System In Package : approaches and challenges.

  • Stéphane Bernabé, Project Leader Photonic Circuits and Modules, CEA-Leti



14.50



15.05

​Session #2 : PICs for Sensing & LIDAR

On-chip 2D beam steering for LiDAR applications

  • Inada Yasuhisa, Chief Researcher, Panasonic

Silicon photonics, an enabling technology for the future LiDARs

  • François Simoens, Strategic Program Manager, CEA-Leti

15.20

Panel Session

  • with III-V LAB, NVIDIA and PANASONIC

15.40

Coffee Break & Networking


16.10



16.25



16.40

​Session #3 : Design tools for PICs 

Photonic design IP

  • Iñigo Artundo, CEO, VLC Photonics

PDK-based design from building block exploration to circuit implementation.

  • Pieter Dumon, co-founder and CTO, LUCEDA Photonics

Title of the presentation to be defined

  • Fabien GaysResearch engineer PDK, CEA-Leti



16.55



17.10

​Session #4 : Packaging & co-pakaging of PICs

To be defined

  • Speaker to be defined, CEA-Leti

2.5D optical and electrical packaging platform

  • Hesham Taha, CEO and co-founder, Teramount

17.30

Closing Session & Discussion

  • Bertrand Szelag, Head of Silicon Photonics lab, CEA-Leti