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3D Technology & Design

Published on 16 October 2020


New wave of innovation thanks to die disintegration

Friday, October 16, 2020 |  08:30 - 12:00 / 13:30 - 15:40


Theme

"New wave of innovation for 3D Integration"  is a one full-day Workshop that brings together experts from both industry and academia to shed light on near-term to long-term challenges around 3D technologies. Experts will cover the latest available results in:

  • 3D Parallel and 3D sequential technologies
  • 3D Design methodologies and tools, reliability and testing
  • 3D Architecture
  • 3D for Computing : Cloud and Edge Computing
  • 3D for Imager and Display applications

This workshop is jointly organized with

Target Audience

Industrials :

  • Target applications (not limited to):computing (cloud, edge); AI; sensors
  • Executive level, strategic/product marketing, R&D engineers

Academia : 

  • 3D experts (technology, packaging, design, architecture)  


General Chair: Séverine Cheramy, CEA-Leti



08.00

​​Registration & Welcome Coffee

08:30


​​​Introduction

  • Séverinne Chéramy, 3D Business Developper, CEA-Leti

​08.40


​Keynote : 3D system integration for high-performance computing 

  • Mustafa Badaroglu, Technical Director, Huawei technologies

09.10



3D Integration technologies for modularity and scalability of chiplet-based computing components

  • Denis Dutoit, Project Leader, Advanced Computing, CEA-List & CEA-Leti

09.35



​Photonic fully integrated circuits using 3D technologies for III-V-semiconductor laser-integration on Silicon

  • Sylvie Menezo, Founder, Scintil Photonics

10.00

Coffee Break & Networking

10.20


CoolCube: breaking news on 3D sequential CEA-Leti's integration

  • Laurent Brunet,  Project leader CEA-Leti

10.45


Die stack as next wave of innovation

  • Emilie Bourjot, 3D Project Leader, CEA-Leti

11.10



Moore's law goes 3D – How bonding will enable continued device scaling?

  • Markus Wimplinger, Corporate Technology Development & IP Director, EV Group

11.35


​Dry processing emergence for 3D packaging

  • Thierry Lazerand, Director Business Unit, Corial

12.00

Buffet Lunch & Networking

​13.30


Analysis of 3D technologies for Imagers

  • Romain Fraux, CEO, System Plus Consulting

13.55


Multi-partners state of the art components assembly to catch new uses for image sensors 

  • Sandra Tochon, Innovation Project Manager, CEA
  • Jean-Luc Jaffard, VP Sensor Engineering and Operations, PROPHESEE
  • Xavier Brenière, Application Labs Manager, LYNRED
  • Speaker to be defined,  ST Microelectronics 

14.25

3D Stacking for Infrared Readout Circuit

  • Patrick Robert, Fellow Expert – Electronic Design, LYNRED

14.50

3D Technologies for Image Sensors

  • François Guyader, 3D principal Engineer, ST Microelectronics

15.00


​​​​Title to be defined

  • Speaker to be defined

15.20

​​​​Title to be defined

  • Speaker to be defined

15.40

Closing Session & Discussion