D43D 2019 - Design for 3D Stacking Workshop
Tuesday, June 25th 2019
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Coupling Design Performance and 3D Technologies
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Leti Design for 3D Stacking is a one full-day Workshop that brings together experts from both industry and academia to shed light on near-term to long-term challenges. Experts will cover the latest available results in:
- 3D sequential technology & 3D memory NVM devices
- Co-integration of 3D Technology
- 3D architecture for computing, interconnects architectures, thermal management
- 3D for photonics and imager applications
- Design methodologies and tools, reliability and testing
For who?
- Industrials
- Designers
- 3D experts
Program
| 08:30 Registration & Welcome coffee |
HPC SESSION
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09:00
| Chiplet-Based Partitioning Using Smart Interposer for High Performance Computing 3D Integrated Systems
- CEA-Leti, Fabien Clermidy
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09:30
| Package Architecture Optimization for High Performance Computing
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10:00
| Requirements for Advanced Co-Packaged Silicon Photonics
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| 10:30 Coffee Break & Networking |
3D IMAGER SESSION
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11:00
| Advanced 3D Technologies and Architectures for 3D Smart Image Sensors
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11:30
| 3D Integration Benefits for Intelligent Image Sensors
- Prophesee, Jean-Luc Jaffard
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12:00
| A Camera with Brain - Embedding Machine Learning in 3D Sensors
- Georgia Institute of Technology, Prof. Saibal Mukhopadhyay
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| 12:30 Buffet Lunch & Networking |
14:00
| From Technology to Market, Stacking Is Becoming Necessary in Multiple Markets & Applications
- Yole Development, Mario Ibrahim
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TECHNOLOGY ENABLER FOR ADVANCED 3D
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14:30
| Advanced 3DIC Technologies
- CEA-Leti, Séverine Cheramy
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15:00
| Die to Wafer Hybrid Bonding Equipment From R&D to Production
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15:30
| New Cu and Co Metallization Enabling Multiple Integrations
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| 16:00 Coffee Break & Networking |
HETEROGENEOUS 3D APPLICATIONS
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16:30
| 3D Landscape for the Post-Moore Transition
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17:00
| Designing Heterogeneous Chips with zGlue
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| 18:00 End |
More info