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Prototyping Pilot Line

Published on 19 June 2019




Friday, June 28th 2019

Prototyping Pilot Line Workshop

Join Leti's Prototyping Pilot Line Workshop to learn more about the institute world-class 300 mm cleanroom space, featuring state-of-the-art equipment and capabilities for a large range of applications from advanced CMOS, photonics, to M&NEMS.  Discover what's doable with the institute non-stop cleanroom facilities : lithography, bonding, deposition, epitaxy growth, CMP, including metrology and offline characterization through a unique Nano-characterization platform.

This workshop is designed for experts looking for pre-industrialization facilities to speed-up their innovation development. Keynoters will discuss the latest techniques available in:

  • Patterning, from lithography solutions to advanced etching
  • Material deposition and their integration
  • Surface processing & bonding, from substrate to 3D integration
  • Process control and development  

LETI 3S Leti's wafer service will also be presented.


For who?

  • Anyone looking for world-class pre-industrialization facilities to speed-up their innovation development.


Program

​08:30    Registration & Welcome Coffee
WORKSHOP INTRODUCTION
​9:00
​Technology Platform: Outlook & Capability
  • CEA-Leti, Laurent Clavelier
​9:15
​The Leti Wafer Service Offer
  • CEA-Leti, Laurent Pain
PATTERNING
​9:30
The Versatility of the Patterning Capability at Leti
  • CEA-Leti, Olivier Faynot
9:45
​Imprint Patterning: a Versatile and Economical Lithography Solution
  • CEA-Leti, Hubert Teyssèdre
​10:00
​From Wet to Etch: Overview to Pattern Transfer Solution
  • CEA-Leti, Nicolas Possémé
​10:15
Patterning module development: from CMOS to photonic​
  • CEA-Leti, Céline Lapeyre
10:30    Coffee Break
WAFER SURFACE TREATMENT
11:00
​Outlook on Wafer Surface Treatment Service
  • CEA-Leti, Véronique Carron
​11:15
​Substrate Innovation Centre at Leti Site - Joint Soitec
  • Soitec, TBD & CEA-Leti, Yann Lami
​11:35
EPI Deposition & Laser Anneal: Advanced Capabilities for 3D Monolithic Developments
  • CEA-Leti, Jean Michel Hartmann & Sébastien Kerdilès
11:50
The Strength of Bonding : The Leti Expertise on Bonding
  • CEA-Leti, Frank Fournel
12:05
Recent Trends in Wafer Bonding Technology
  • EVG, Tobias Wernicke
12:30​    Buffet Lunch
BREAK MATERIALS & DEPOSITION
​14:00
​Overview of Advanced Material Deposition Capabilities
  • CEA-Leti, Bernard André
14:15
Advanced Metal Contacts: From Material Research to Industrial Integration
  • CEA-Leti, Philippe Rodriguez
14:30
Bringing 2D Materials to Industrial Applications
  • CEA-Leti, Cécile Moulin
14:40
Piezoelectric Materials Roadmap at Leti
  • CEA-Leti, Guillaume Rodriguez
14:50
GaN Material Development Status
  • CEA-Leti, Bérangère Hyott
​15:00
Materials for Topologic Isolation
  • CEA-Leti, Philippe Ballet
15:15
​AVENI Solutions for 3D Integration
  • Invited talk, TbD
15:30​    Coffee Break
ADVANCED METROLOGY & CHARACTERIZATION PLATFORM
​16:00
The In-Line Metrology & NanoCharacterization Plateform
  • CEA-Leti, Nicolas Lhermet
16:15
Advanced Metrology Industrial Collaborations
  • CEA-Leti, Carlos Beitia
​16:30
New Developments in TEM for Analytical & Physical Characterization
  • CEA-Leti, David Cooper
16:45
PP-TOFMS: Example of an Horiba JDP
  • CEA-Leti, J.P Barnes
​17:00
​Invited talk
  • UNITY
CONCLUSION
​ 17:15
​Wrap-up of a Journey into the Leti Technology Platform
  • CEA-Leti, Laurent Pain
​17:30    End

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